What's the Latest Development?
This week at the Institute for Electrical and Electronics Engineers' RFID conference in Orlando, scientists from North Dakota State University are scheduled to present a new form of "smart" paper created with a process they call Laser Enabled Advanced Packaging (LEAP). This process involves thinning down RFID chips to the point where they can be transferred to paper using a laser. According to project lead Val Marinov, LEAP "is twice as fast as current methods of manufacturing and is cheaper because there is less material used and the equipment is less expensive."
What's the Big Idea?
RFID-embedded paper already exists, but in most cases the chips are relatively thick, making it difficult to use for printing. In contrast, paper created with the LEAP technology could be used for many different types of items ranging from banknotes to concert tickets to legal documents. Marinov says that, despite certain banks' announced intentions to create similar paper years ago, his team may be the first to come up with a truly workable option. They are currently looking for partners to help them bring the paper to market.
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